Cheng Uei Precision Industry filed 1 patent application in H1 2026, covering Hardware.
The filing describes a joystick assembly that uses injection-molded cable integration and conductive soft plastic materials. This approach targets reduced manufacturing complexity in gaming controller production through cost-optimized component design.
On the Hardware side, 1 patent focuses on simplifying how gaming controllers are manufactured at the component level. Rather than treating cable installation as its own assembly step, the filed application describes a process where cables are incorporated directly during the injection molding of the key cap itself. The key cap material also serves a dual purpose, using conductive soft plastic to handle electrical conductivity without requiring separate conductive elements to be added later.
All data sourced from USPTO patent filings. Google Patents may take several weeks to index recent publications. If a link is unavailable, search for the patent number at USPTO Patent Public Search.